Hybrid silicon and glass interposer for combined optical and memory system-in-package

This paper proposes a low-cost packaging configuration for a combined optical and memory system-in-package. The proposed hybrid silicon and glass configuration meets the wiring density required for HBM and high-frequency characteristics required for optical IC wiring. We also built and tested a wiring TEG to evaluate the high-frequency performance of 25 Gbps differential transmission wiring for optical ICs in the glass interposer region, thereby seeking to minimize losses and reduce power consumption. Experiments showed satisfactory transfer characteristics of □0.8 dB/cm.