• DocumentCode
    256128
  • Title

    Effect of layered media on the parallel plate impedance of printed circuit boards

  • Author

    Dahl, D. ; Muller, S. ; Schuster, C.

  • Author_Institution
    Tech. Univ. Hamburg-Harburg (TUHH), Hamburg, Germany
  • fYear
    2014
  • fDate
    14-16 Dec. 2014
  • Firstpage
    29
  • Lastpage
    32
  • Abstract
    This paper evaluates the impact of layered media on the parallel plate impedance of printed circuit boards. In the parallel plate impedance computation using the radial waveguide method (RWM) for infinite planes and a contour integral method (CIM) for finite planes, the layered nature of investigated structures can be accounted for by effective wave numbers. Here, the effective wave numbers are obtained using either an exact solution from the transverse resonance method (TRM) or adopting approximations based on the assumption of quasi-TEM fields and the applicability of suitable averages. The wave numbers obtained with these techniques are compared for typical structures of interest, and the parallel plate impedance computed with effective wave numbers is evaluated and compared to a full wave solution. The results show that a comparatively simple approximation for the effective wave number is sufficient for an accurate parallel plate impedance calculation.
  • Keywords
    electric impedance; inhomogeneous media; printed circuits; waveguides; contour integral method; effective wave numbers; infinite planes; layered media effect; parallel plate impedance; printed circuit boards; quasiTEM fields; radial waveguide method; transverse resonance method; Approximation methods; Dielectric losses; Impedance; Nonhomogeneous media; Permittivity; Transmission line measurements; contour integral method; layered media; parallel plate impedance; parallel plate waveguide; radial waveguide method; transverse resonance method; wave number;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2014 IEEE
  • Conference_Location
    Bangalore
  • Type

    conf

  • DOI
    10.1109/EDAPS.2014.7030807
  • Filename
    7030807