Title :
Increasing Efficiency of a Chemical-Mechanical Polishing of the Silicon Wafer
Author :
Khmelev, Vladimir N. ; Shalunov, Andrey V. ; Smerdina, Elena S.
Author_Institution :
Biysk Technol. Inst., I.I. Polzunov Altay State Tech. Univ., Biysk
Abstract :
The present paper is concerned with the reasons of increasing the efficiency of one of the basic processes in manufacturing of semiconductors -chemical-mechanical polishing (CMP). The promising researches-and-experiments based way of the above problem solution by the application of ultrasonic spraying of a polishing liquid is offered. The paper reports the design which allows to embed the ultrasonic apparatus in the present equipment for CMP process
Keywords :
chemical mechanical polishing; spraying; ultrasonic cleaning; ultrasonic devices; CMP; chemical-mechanical polishing; polishing liquid; semiconductor manufacturing; silicon wafer; ultrasonic apparatus; ultrasonic devices; ultrasonic spraying; Abrasives; Chemical elements; Chemical industry; Chemical processes; Chemical technology; Lithography; Manufacturing processes; Semiconductor device manufacture; Silicon; Spraying; Semiconductors; chemical mechanical polishing; ultrasonic devices;
Conference_Titel :
Electron Devices and Materials, 2006. Proceedings. 7th Annual 2006 International Workshop and Tutorials on
Conference_Location :
Erlagol, Altai
Print_ISBN :
5-7782-0646-1
DOI :
10.1109/SIBEDM.2006.231297
