• DocumentCode
    256167
  • Title

    High-speed data transmission system using half mode substrate integrated waveguide

  • Author

    Xi-Wang Yuan ; Xiao-Chun Li ; Ning Wang ; Xiao-Jian Ma ; Yan Shao ; Jun-Fa Mao

  • Author_Institution
    Key Lab. of Minist. of Educ. for Res. of Design & EMC of High Speed Electron. Syst., Shanghai Jiao Tong Univ., Shanghai, China
  • fYear
    2014
  • fDate
    14-16 Dec. 2014
  • Firstpage
    105
  • Lastpage
    108
  • Abstract
    A high-speed data transmission system using half mode substrate integrated waveguide (HMSIW) is proposed in this paper. The HMSIW transmits the signal by TE0.5,0 mode so the channel bandwidth is from the cutoff frequency of TE0.5,0 mode to the cutoff frequency of TE1.5,0 mode. In contrast, the traditional SIW transmits the signal by TE10 mode and the channel bandwidth is from the cutoff frequency of TE10 mode to the cutoff frequency of TE20 mode. Therefore, the bandwidth of the proposed HMSIW is 2 times larger than that of the traditional SIW with 2 times waveguide width of HMSIW. Comparison between the interconnect systems based on HMSIW and SIW shows that the HMSIW-based interconnect system has a better performance in high-speed data transmission. The data transmission rate of the proposed HMSIW system can reach up to 7.5 Gbps while that of the traditional SIW system is only 5Gbps with the same condition.
  • Keywords
    data communication; substrate integrated waveguides; HMSIW; TE0.5,0 mode; TE1.5,0 mode; TE10 mode; TE20 mode; channel bandwidth; cutoff frequency; high-speed data transmission system; interconnect systems; mode substrate integrated waveguide; Bandwidth; Bit error rate; Cutoff frequency; Data communication; Integrated circuit interconnections; Mixers; Substrates; SIW; half mode; high-speed transmission; interconnect; signal integrity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2014 IEEE
  • Conference_Location
    Bangalore
  • Type

    conf

  • DOI
    10.1109/EDAPS.2014.7030826
  • Filename
    7030826