Silicon-package power delivery co-simulation with Fully Integrated Voltage Regulators on microprocessors

Author

Govindan, S. ; Venkataraman, S.

Author_Institution

Intel Technol. India Private Ltd., Bangalore, India

fYear

2014

fDate

14-16 Dec. 2014

Firstpage

113

Lastpage

116

Abstract

Fully Integrated Voltage Regulator (FIVR) has been introduced on Intel® Xeon® microprocessors which are switching power converters on die. The FIVR design includes air core inductor structures implemented on the package along with output capacitor, compensators, power transistors and control circuits implemented on-die. FIVR analysis has to comprehend and co-optimize both the package and the die. The power delivery analysis of FIVR is presented and design optimizations are discussed.

Keywords

circuit optimisation; circuit simulation; elemental semiconductors; integrated circuit design; integrated circuit packaging; microprocessor chips; silicon; switching convertors; voltage regulators; FIVR design; Intel Xeon microprocessors; Si; air core inductor structures; compensators; control circuits; design optimizations; fully integrated voltage regulators; output capacitor; power transistors; silicon-package power delivery co-simulation; switching power converters; Analytical models; Bandwidth; Frequency-domain analysis; Inductors; Integrated circuit modeling; Load modeling; Power transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Design of Advanced Packaging & Systems Symposium (EDAPS), 2014 IEEE

Conference_Location

Bangalore

Type

conf

DOI

10.1109/EDAPS.2014.7030828

Filename

7030828