DocumentCode :
2562106
Title :
Characterization of uni-axially stressed Si and Ge concentration in Si1-xGex using polychromator-based multi-wavelength Raman spectroscopy
Author :
Yoo, Woo Sik ; Ueda, Takeshi ; Kang, Kitaek
Author_Institution :
WaferMasters, Inc., San Jose, CA, USA
fYear :
2009
fDate :
11-12 June 2009
Firstpage :
79
Lastpage :
83
Abstract :
The design concept of a polychromator-based multi-wavelength Raman spectroscopy system (MRS-300) which is designed to overcome the common issues with conventional Raman measurement systems is described. The system is specially designed for non-destructive, material and process characterization applications in the semiconductor industry. The performance of the MRS-300 system and non-destructive nature of the tests of lattice stress/strain and Ge content were demonstrated using mechanically stressed Si samples and epitaxially grown Si1-xGex samples. The capability of very high measurement resolution (0.105 cm-1/pixel or better), accuracy repeatability (0.05 cm-1 or better) and repeatability (0.05 cm-1 or better) of the system were demonstrated at all three excitation wavelengths (457.9 nm, 488.0 nm and 514.5 nm). Possibility of MRS-300 applications as an in-line process monitoring system was also introduced with an example of long term measurement stability and repeatability data.
Keywords :
Ge-Si alloys; Raman spectroscopy; epitaxial growth; nondestructive testing; semiconductor industry; MRS-300; Raman measurement; Si1-xGex; epitaxial growth; in-line process monitoring; lattice stress/strain; measurement stability; multiwavelength Raman spectroscopy; nondestructive test; polychromator; semiconductor industry; uniaxial stress; Capacitive sensors; Electronics industry; Lattices; Nondestructive testing; Raman scattering; Semiconductor materials; Spectroscopy; Stress; System testing; Wavelength measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Junction Technology, 2009. IWJT 2009. International Workshop on
Conference_Location :
Kyoto
Print_ISBN :
978-1-4244-3319-3
Electronic_ISBN :
978-1-4244-3320-9
Type :
conf
DOI :
10.1109/IWJT.2009.5166224
Filename :
5166224
Link To Document :
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