DocumentCode :
2562147
Title :
Advanced plasma doping technique for USJ
Author :
Godet, Ludovic ; Papasouliotis, George D. ; Kontos, Alex ; Miller, Timothy ; Singh, Vikram
Author_Institution :
Varian Semicond. Equip. Assoc., Inc., Gloucester, MA, USA
fYear :
2009
fDate :
11-12 June 2009
Firstpage :
86
Lastpage :
90
Abstract :
SDE implants were carried out in a VIISta PLAD system using both p- and n-type dopant precursors. The advanced control features in the PLAD system allowed for dopant profile control by appropriately balancing the constituent components of the plasma doping process, and retrograde dopant profiles were demonstrated for the first time using a plasma doping system. The p-doped samples were flash annealed, and fully re-crystallized. The achieved profile abruptness, and combination of sheet resistance and junction depth exceeded the ITRS requirements for the 32 nm technology node. The technique was extended to n-type USJ.
Keywords :
CMOS logic circuits; doping profiles; electrical resistivity; incoherent light annealing; plasma immersion ion implantation; semiconductor doping; semiconductor junctions; USJ; advanced Logic CMOS devices; advanced plasma doping; dopant profile control; flash annealing; junction depth; n-type dopant precursors; profile abruptness; sheet resistance; source drain extension implants; ultra shallow junctions; Annealing; Application specific integrated circuits; CMOS technology; Control systems; Energy consumption; Implants; Logic devices; Plasma density; Random access memory; Semiconductor device doping;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Junction Technology, 2009. IWJT 2009. International Workshop on
Conference_Location :
Kyoto
Print_ISBN :
978-1-4244-3319-3
Electronic_ISBN :
978-1-4244-3320-9
Type :
conf
DOI :
10.1109/IWJT.2009.5166226
Filename :
5166226
Link To Document :
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