Effective transient process modelling of the reflow soldering of printed circuit assemblies

Author

Sarvar, Farhad ; Conway, Paul P.

Author_Institution

Dept. of Manuf. Eng., Loughborough Univ. of Technol., UK

fYear

1996

fDate

29 May-1 Jun 1996

Firstpage

195

Lastpage

202

Abstract

Process modelling of the reflow soldering of Printed Circuit Assemblies (PCAs) requires complex thermal models incorporating a number of modes of heat transfer, including radiation (infra red) and (forced/free) convection. This paper describes the development of representative process models of the reflow soldering of PCAs and outlines some of the more important parameters to consider for accurate simulation of the reflow process. Results are also presented illustrating the variation with temperature of critical properties for electronic materials, such as for FR-4 and epoxy based packaging materials

Keywords

printed circuit manufacture; reflow soldering; thermal analysis; transient analysis; FR-4; critical properties; electronic packaging material; epoxy; heat transfer; printed circuit assembly; reflow soldering; simulation; thermal model; transient process modelling; Assembly; Electronic packaging thermal management; Heat transfer; Manufacturing processes; Predictive models; Principal component analysis; Printed circuits; Production equipment; Reflow soldering; Semiconductor device modeling;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal Phenomena in Electronic Systems, 1996. I-THERM V., Inter-Society Conference on

Conference_Location

Orlando, FL

Print_ISBN

0-7803-3325-X

Type

conf

DOI

10.1109/ITHERM.1996.534562

Filename

534562