Surface mounted assembly of SIW circuits for flexible communication applications

Author

Buiculescu, Valentin ; Costovici, Stefania

Author_Institution

IMT - Bucharest, Bucharest, Romania

Volume

1

fYear

2011

fDate

17-19 Oct. 2011

Firstpage

211

Lastpage

214

Abstract

The paper presents a new connection topology intended for flexible integration of substrate-integrated waveguide (SIW) components, based on a building blocks concept. This connection type was experimentally validated on a model made of FR-4 substrate, by using printed circuit board (PCB) technology, with a bandwidth exceeding the regular 5 GHz unlicensed telecommunications frequency range. The measured results are in excellent agreement with simulated two-port parameters. The transition geometry is compatible with surface mounted technology (SMT).

Keywords

printed circuits; substrate integrated waveguides; substrates; surface mount technology; FR-4 substrate; SIW circuits; connection topology; flexible communication application; flexible integration; printed circuit board technology; substrate-integrated waveguide components; surface mounted assembly; surface mounted technology; Assembly; Couplings; Electromagnetic waveguides; Microstrip; Microwave filters; Probes; Substrates; Substrate-integrated waveguide; building block; coplanar waveguide; coupling structure; microstrip line;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Conference (CAS), 2011 International

Conference_Location

Sinaia

ISSN

1545-827X

Print_ISBN

978-1-61284-173-1

Type

conf

DOI

10.1109/SMICND.2011.6095761

Filename

6095761