DocumentCode
2562789
Title
Teflon bonding of silicon solar cells
Author
White, P.A. ; Jones, D.E.
fYear
1991
fDate
7-11 Oct 1991
Firstpage
1508
Abstract
The silicon adhesive used to bond coverglass onto a solar cell can be replaced by a thin layer of FEP Teflon. The advantage of using Teflon as the adhesive is that it is supplied as a thin sheet in thicknesses of 25 or 50 μm and can be cut to size prior to use. A review is presented of the work done to date on the Teflon bonding process including the results of some critical EOL tests
Keywords
Bonding processes; Delamination; Electrostatics; Glass; Photovoltaic cells; Silicon; Temperature; Testing; Thermal expansion; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Photovoltaic Specialists Conference, 1991., Conference Record of the Twenty Second IEEE
Conference_Location
Las Vegas, NV
Print_ISBN
0-87942-636-5
Type
conf
DOI
10.1109/PVSC.1991.169455
Filename
169455
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