• DocumentCode
    2563091
  • Title

    The negative bias temperature instability vs. high-field stress paradigm

  • Author

    Campbell, J.P. ; Cheung, K.P. ; Suehle, J.S. ; Oates, A.S.

  • Author_Institution
    Semicond. Electron. Div., Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA
  • fYear
    2009
  • fDate
    18-20 May 2009
  • Firstpage
    79
  • Lastpage
    82
  • Abstract
    A new and more accurate fast-IDVG measurement methodology is utilized to examine the transient degradation and recovery associated with the negative-bias temperature instability (NBTI). The results reveal that the anomalously large initial degradations reported in the recent literature are actually due to high-field stress acceleration and are not representative of low-field NBTI phenomena. Our observations at these higher fields reveal the presence of an, as yet unaccounted for, electron trapping/de-trapping component. The electron trapping is a signature of high-field stress degradation. While this high-field stress acceleration is unavoidable, care must be taken to account for this component in NBTI analysis. Collectively, our observations indicate that this high-field stress component is present and unaccounted for in a large portion of the recent NBTI literature.
  • Keywords
    MOSFET; electron traps; high field effects; transients; electron de-trapping component; electron trapping; high field stress acceleration; high field stress component; high field stress degradation; negative bias temperature instability; transient degradation; Acceleration; CMOS technology; Degradation; Electron traps; Negative bias temperature instability; Niobium compounds; Oscilloscopes; Stress measurement; Threshold voltage; Titanium compounds; NBTI; electron trapping; high-field stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    IC Design and Technology, 2009. ICICDT '09. IEEE International Conference on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    978-1-4244-2933-2
  • Electronic_ISBN
    978-1-4244-2934-9
  • Type

    conf

  • DOI
    10.1109/ICICDT.2009.5166270
  • Filename
    5166270