DocumentCode
2563183
Title
Dynamics of charge collection in pixelated semiconductor sensor studied with heavy ions and Timepix
Author
Soukup, Pavel ; Jakubek, Jan ; Martisikova, Maria ; Kroupa, Martin ; Pospisil, Stanislav
Author_Institution
Inst. of Exp. & Appl. Phys., Czech Tech. Univ. in Prague, Prague, Czech Republic
fYear
2012
fDate
Oct. 27 2012-Nov. 3 2012
Firstpage
4184
Lastpage
4187
Abstract
This paper presents a novel technique allowing for the measurement and visualization of the spatial distribution and time evolution of the charge collection process in semiconductor sensors of ionizing radiation. The study was carried out with a pixelated high resistivity silicon sensor bump-bonded to the Timepix readout chip (256 × 256 pixels, with pitch of 55 μm). The sensor was irradiated with energetic protons (132 MeV) and carbon ions (240 MeV/u) entering the sensor at shallow angles. Such ions penetrate the full sensor thickness ionizing and depositing charge along their tracks. The charge deposited is collected by individual pixels of the Timepix chip operated in Time mode. The overall accuracy of these measurements was enhanced by averaging many particle tracks. The time accuracy is in order of nanoseconds and the position accuracy is about 5 μm. The purpose of this work is to demonstrate the accurate measurement that may be used with the mathematical model to investigate the electric field profile in a semiconductor sensor.
Keywords
nuclear electronics; particle tracks; readout electronics; silicon radiation detectors; Timepix chip; Timepix readout chip; carbon ions; charge collection dynamics; charge collection process; electric field profile; electron volt energy 132 MeV; energetic protons; ionizing radiation; mathematical model; particle tracks; pixelated high resistivity silicon sensor; pixelated semiconductor sensor; position accuracy; sensor thickness; spatial distribution visualization; time evolution; time mode;
fLanguage
English
Publisher
ieee
Conference_Titel
Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC), 2012 IEEE
Conference_Location
Anaheim, CA
ISSN
1082-3654
Print_ISBN
978-1-4673-2028-3
Type
conf
DOI
10.1109/NSSMIC.2012.6551955
Filename
6551955
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