• DocumentCode
    2563207
  • Title

    Suppression of interface-induced noise by the control of electron-phonon interactions

  • Author

    Hammig, Mark D. ; Taehoon Kang ; Manhee Jeong ; Jarrett, Michael

  • Author_Institution
    Dept. of Nucl. Eng. & Radiol. Sci., Univ. of Michigan, Ann Arbor, MI, USA
  • fYear
    2012
  • fDate
    Oct. 27 2012-Nov. 3 2012
  • Firstpage
    4188
  • Lastpage
    4195
  • Abstract
    We study the influence of various types of contacting media and contact area on the current-fluctuation level in semiconductors, testing the supposition that the electronic noise is governed, in part, by phonon-leaking dynamics to the environment. Using passivated and gettered silicon PIN diodes as experimental test-beds, the presented data lends credence to the prediction that the phonon-refraction characteristics of the semiconductor-metal interface substantially impacts the current fluctuations in the solid. Specifically, if one implements metallic contacts with lower phonon-reflecting characteristics, such as those composed of silver or palladium, or if one increases the area through which phonons can leakage to the surrounding environment, then the leakage current decreases.
  • Keywords
    current fluctuations; electron-phonon interactions; elemental semiconductors; interface phonons; leakage currents; p-i-n diodes; palladium; semiconductor device noise; semiconductor-metal boundaries; silicon; silver; Ag-Si; Pd-Si; contact area; contacting media; current-fluctuation level; electron-phonon interactions; electronic noise; experimental test-beds; interface-induced noise; leakage current; metallic contacts; passivated gettered silicon PIN diodes; phonon-leaking dynamics; phonon-reflecting characteristics; phonon-refraction characteristics; semiconductor-metal interface;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC), 2012 IEEE
  • Conference_Location
    Anaheim, CA
  • ISSN
    1082-3654
  • Print_ISBN
    978-1-4673-2028-3
  • Type

    conf

  • DOI
    10.1109/NSSMIC.2012.6551956
  • Filename
    6551956