DocumentCode :
2563207
Title :
Suppression of interface-induced noise by the control of electron-phonon interactions
Author :
Hammig, Mark D. ; Taehoon Kang ; Manhee Jeong ; Jarrett, Michael
Author_Institution :
Dept. of Nucl. Eng. & Radiol. Sci., Univ. of Michigan, Ann Arbor, MI, USA
fYear :
2012
fDate :
Oct. 27 2012-Nov. 3 2012
Firstpage :
4188
Lastpage :
4195
Abstract :
We study the influence of various types of contacting media and contact area on the current-fluctuation level in semiconductors, testing the supposition that the electronic noise is governed, in part, by phonon-leaking dynamics to the environment. Using passivated and gettered silicon PIN diodes as experimental test-beds, the presented data lends credence to the prediction that the phonon-refraction characteristics of the semiconductor-metal interface substantially impacts the current fluctuations in the solid. Specifically, if one implements metallic contacts with lower phonon-reflecting characteristics, such as those composed of silver or palladium, or if one increases the area through which phonons can leakage to the surrounding environment, then the leakage current decreases.
Keywords :
current fluctuations; electron-phonon interactions; elemental semiconductors; interface phonons; leakage currents; p-i-n diodes; palladium; semiconductor device noise; semiconductor-metal boundaries; silicon; silver; Ag-Si; Pd-Si; contact area; contacting media; current-fluctuation level; electron-phonon interactions; electronic noise; experimental test-beds; interface-induced noise; leakage current; metallic contacts; passivated gettered silicon PIN diodes; phonon-leaking dynamics; phonon-reflecting characteristics; phonon-refraction characteristics; semiconductor-metal interface;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC), 2012 IEEE
Conference_Location :
Anaheim, CA
ISSN :
1082-3654
Print_ISBN :
978-1-4673-2028-3
Type :
conf
DOI :
10.1109/NSSMIC.2012.6551956
Filename :
6551956
Link To Document :
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