Title :
Model and numerical simulation of thin film structure
Author :
Kostyuk, G.I. ; Levchenko, I.G.
Author_Institution :
Dept. of Robotics, Kharkov State Aerosp. Univ., Ukraine
Abstract :
The model of thin film structure allowing calculation of the most significant characteristics such as porosity, micro-stress, and adhesion was developed and numerically studied
Keywords :
adhesion; numerical analysis; porosity; stress analysis; thin films; adhesion; aggregate distribution function; micro-stress; numerical simulation; porosity; thin film structure; Adhesives; Aggregates; Dielectrics and electrical insulation; Distribution functions; Frequency; Integral equations; Numerical models; Numerical simulation; Robots; Transistors;
Conference_Titel :
Discharges and Electrical Insulation in Vacuum, 2000. Proceedings. ISDEIV. XIXth International Symposium on
Conference_Location :
Xi´an
Print_ISBN :
0-7803-5791-4
DOI :
10.1109/DEIV.2000.879056
