• DocumentCode
    2563360
  • Title

    Heat transfer from grooved surfaces to flow of fluorinert coolant in reduced-size channels

  • Author

    Mizunuma, Hitoshi ; Behnia, Masud ; Nakayama, Wataru

  • Author_Institution
    Dept. of Mech. & Intell. Syst. Eng., Tokyo Inst. of Technol., Japan
  • fYear
    1996
  • fDate
    29 May-1 Jun 1996
  • Firstpage
    274
  • Lastpage
    283
  • Abstract
    Experiments were conducted in order to investigate the forced convective heat transfer from a grooved surface to a fluorocarbon liquid FX3250. The heat transfer surface is made from copper, has a base area 2×2 cm2, and is equipped with 20 longitudinal fins, each fin being 0.5 mm high and 0.5 mm wide. A particular attention was directed to the effect of the channel height (H) on the heat transfer performance, changing H from 1 to 3 mm. The Reynolds number based on the hydraulic diameter covered a range from 1000 to 12000. Also conducted was an experiment using a flat heat transfer surface. It was found that the sensitivity of heat transfer performance to the change of H depends on the type of heat transfer surface. Comparisons are presented in terms of the heat transfer coefficient based on the actual heat transfer area. In order to interpret the experimental data the numerical simulation of flow and heat transfer was performed. The results indicate the interactive effects of flow distribution and local rise of the coolant temperature in the grooved-surface channel
  • Keywords
    cooling; forced convection; modules; packaging; 1 to 3 mm; Reynolds number; channel height; coolant temperature; fluorinert coolant; forced convective heat transfer; grooved surfaces; heat transfer coefficient; heat transfer surface; hydraulic diameter; interactive effects; longitudinal fins; reduced-size channels; Acceleration; Coolants; Copper; Heat transfer; Hydraulic diameter; Intelligent manufacturing systems; Systems engineering and theory; Temperature; Thermal conductivity; Water heating;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Phenomena in Electronic Systems, 1996. I-THERM V., Inter-Society Conference on
  • Conference_Location
    Orlando, FL
  • Print_ISBN
    0-7803-3325-X
  • Type

    conf

  • DOI
    10.1109/ITHERM.1996.534573
  • Filename
    534573