DocumentCode :
2563372
Title :
Combined pressure and subcooling effects on pool boiling from a PPGA chip package
Author :
Watwe, A.A. ; Bar-Cohen, A. ; McNeil, A.
Author_Institution :
Minnesota Univ., Minneapolis, MN, USA
fYear :
1996
fDate :
29 May-1 Jun 1996
Firstpage :
284
Lastpage :
291
Abstract :
This study presents a detailed experimental investigation of the combined effects of pressure and subcooling on nucleate pool boiling and critical heat flux (CHF) for degassed fluorocarbon FC-72 boiling on a plastic-pin-grid-array (PPGA) chip package. In these experiments, pressure was varied between 101.3 and 303.9 kPa, and the subcooling ranged from 0 to 65°C. As expected, lower wall superheats resulted from increases in pressure, while subcooling had a minimal effect on fully-developed pool boiling. However, the superheat reductions and CHF enhancements were found to be smaller than those predicted by existing models. The saturation CHF increased by nearly 17% for an increase in pressure from 101.3 to 202.7 kPa. In experiments with both FC-72 and FC-87, further increases in pressure did not produce any significant increase in CHF. At a pressure of 101.3 kPa, a subcooling of 30°C increased CHF on horizontal, upward-facing chips by approximately 50% as compared to 70% on vertically oriented packages. The enhancement in CHF due to subcooling decreased rapidly with increasing pressure and the data showed that the influence of pressure and subcooling on CHF is not additive. A correlation to predict pool boiling CHF under the combined effects of pressure and subcooling is proposed
Keywords :
boiling; cooling; integrated circuit packaging; plastic packaging; 0 to 65 degC; 101.3 to 303.9 kPa; PPGA chip package; critical heat flux; degassed fluorocarbon FC-72; nucleate pool boiling; plastic-pin-grid-array chip package; pressure effects; subcooling effects; upward-facing chips; vertically oriented packages; wall superheats; Electronic packaging thermal management; Heat sinks; Heat transfer; Immersion cooling; Liquids; Plastic packaging; Resistance heating; Temperature; Thermal conductivity; Thermal management;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal Phenomena in Electronic Systems, 1996. I-THERM V., Inter-Society Conference on
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-3325-X
Type :
conf
DOI :
10.1109/ITHERM.1996.534574
Filename :
534574
Link To Document :
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