Title :
Correlations for single-phase convective heat transfer from an array of three-dimensional obstacles in a channel
Author :
Morris, Garron K. ; Garimella, Suresh V.
Author_Institution :
Dept. of Mech. Eng., Wisconsin Univ., Milwaukee, WI, USA
fDate :
29 May-1 Jun 1996
Abstract :
Empirical correlations are developed to predict the element-averaged convective heat transfer from inline arrays of wall-mounted, three-dimensional protruding heat sources. The composite correlations are based on data from a large database of experiments that covered a wide range of flow rates (chip length-based Reynolds numbers from 600 to 70000), geometries, array spacings, and Prandtl numbers (0.7 to 25.2). The data were obtained from unpublished in-house experiments as well as from a number of studies in the literature. Air, water, and FC-77 (a perfluorinated dielectric liquid) are the coolants considered. A correlation valid for all the fluids is proposed with the Nusselt number as a function of Reynolds and Prandtl numbers, the array spacing, and the channel geometry. A separate correlation is proposed for air data only. The proposed correlations are compared with other predictive formulae in the literature
Keywords :
cooling; forced convection; packaging; Nusselt number; Prandtl numbers; Reynolds numbers; array spacings; channel geometry; coolants; element-averaged heat transfer; flow rates; inline arrays; predictive formulae; single-phase convective heat transfer; three-dimensional obstacles; wall-mounted three-dimensional protruding heat sources; Coolants; Electronics cooling; Fluid flow; Geometry; Heat engines; Heat transfer; Temperature; Thermal conductivity; Thermal management of electronics; Viscosity;
Conference_Titel :
Thermal Phenomena in Electronic Systems, 1996. I-THERM V., Inter-Society Conference on
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-3325-X
DOI :
10.1109/ITHERM.1996.534575