Thermal characterization of stacked aluminum nitride multichip modules

Recent development in three-dimensional packaging technology prompts necessary thermal characterization of developed modules. This paper presents the numerical results of temperature and heat flux profiles of a selected stacked module. The model simulates a stacked, multilayer multichip module (MCMs) using aluminum nitride (AlN) substrates with Technology Characterization Vehicles (TCVs) configuration. The simulation conditions for thermal analysis are specified as the single- or two- layered module, with discrete heat sources, mounted on a constant temperature heat sink. A commercial finite element code (COSMOS/M) is used to obtain thermal analysis results by incorporating the convective boundary conditions. The results include temperature and heat flux distribution in the module where chips have different bonding conditions (wire bonded and flip chip). The simulation results are compared with preliminary experimental test data