Thermal modeling of discrete microelectronic elements within three-dimensional continuous models

Author

Creel, Kenneth E. ; Nelson, Douglas J.

Author_Institution

Dept. of Mech. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA

fYear

1996

fDate

29 May-1 Jun 1996

Firstpage

383

Lastpage

390

Abstract

A method for incorporating the thermal effects of discrete microelectronics features (such as vias, wire bonds and pins) into conventional thermal analysis tools is described. The method uses the concept of equivalent thermal resistance and the input parameters of convective boundary conditions and volumetric source terms. Example results are given for a simplified multichip module illustrating the effects of each of these features

Keywords

convection; cooling; integrated circuit modelling; integrated circuit packaging; multichip modules; thermal analysis; thermal resistance; convective boundary conditions; discrete microelectronic elements; equivalent thermal resistance; input parameters; multichip module; pins; thermal analysis tools; thermal modeling; three-dimensional continuous models; vias; volumetric source terms; wire bonds; Boundary conditions; Electronic packaging thermal management; Equations; Heat transfer; Microelectronics; Multichip modules; Nonhomogeneous media; Pins; Thermal resistance; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal Phenomena in Electronic Systems, 1996. I-THERM V., Inter-Society Conference on

Conference_Location

Orlando, FL

Print_ISBN

0-7803-3325-X

Type

conf

DOI

10.1109/ITHERM.1996.534586

Filename

534586