DocumentCode
2563734
Title
A convergence robust method to model snapback for ESD simulation
Author
Wei, Linpeng ; Gill, Chai Ean ; Li, Weiying ; Wang, Richard ; Zunino, Mike
Author_Institution
Freescale Semicond. China, Beijing, China
Volume
2
fYear
2011
fDate
17-19 Oct. 2011
Firstpage
369
Lastpage
372
Abstract
A new behavior modeling method is presented to model ESD protection devices with voltage snapback. It resolves the convergence problem induced by snapback characteristic. The model can pass HBM, MM and TLP transient simulations in SPICE. The reason for convergence robustness is also discussed.
Keywords
convergence; electrostatic devices; electrostatic discharge; transient analysis; ESD protection device model; ESD simulation; SPICE; TLP transient simulations; behavior modeling method; convergence robust method; voltage snapback model; Computational modeling; Convergence; Electrostatic discharges; Equations; Integrated circuit modeling; Mathematical model; Transient analysis; ESD simulation; convergence; modeling; snapback;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Conference (CAS), 2011 International
Conference_Location
Sinaia
ISSN
1545-827X
Print_ISBN
978-1-61284-173-1
Type
conf
DOI
10.1109/SMICND.2011.6095819
Filename
6095819
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