• DocumentCode
    2564158
  • Title

    Development of a digital acquisition system for partial discharge measurement and analyses

  • Author

    Jambula, A. ; Nimbole, V. ; Lakdawala, V. ; Basappa, P.

  • Author_Institution
    Old Dominion Univ., Norfolk, VA, USA
  • fYear
    2009
  • fDate
    May 31 2009-June 3 2009
  • Firstpage
    60
  • Lastpage
    63
  • Abstract
    A typical set of partial discharges (PD) occurring in insulation systems can be characterized by a three dimensional plot of their phase dasiaphipsila on the power line cycle, apparent charge magnitude dasiaqpsila and the number of pulses dasianpsila. A digital acquisition system is being developed which can measure dasiaphipsila and dasiaqpsila values of dasianpsila PD´s occurring on a given power line voltage and then plot n(phi, q). The system is developed using the data acquisition card NI-5112, which is a 2-channel high speed digitizer (100 MS/s) with the acquisition and analyses programs written in LabVIEW 8.2. The system is being tested using artificially generated PD pulses which have variable dasiaphipsila and dasiaqpsila magnitudes and their performance benchmarked by comparing the resulting plots with the plots obtained by processing the same data on existing PD analyses system called TECHIMP-PD check.
  • Keywords
    analogue-digital conversion; data acquisition; partial discharge measurement; apparent charge magnitude; data acquisition card; digital acquisition system; high speed digitizer; insulation systems; partial discharge analyses; partial discharge measurement; power line cycle; Benchmark testing; Data acquisition; Insulation; Partial discharge measurement; Partial discharges; Power measurement; Pulse generation; Q measurement; System testing; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference, 2009. EIC 2009. IEEE
  • Conference_Location
    Montreal, QC
  • Print_ISBN
    978-1-4244-3915-7
  • Electronic_ISBN
    978-1-4244-3917-1
  • Type

    conf

  • DOI
    10.1109/EIC.2009.5166324
  • Filename
    5166324