• DocumentCode
    2564629
  • Title

    Machine condition monitoring using omnidirectional thermal imaging system

  • Author

    Wong, Wai Kit ; Tan, Poi Ngee ; Loo, Chu Kiong ; Lim, Way Soong

  • Author_Institution
    Fac. of Eng. & Technol., Multimedia Univ., Ayer Keroh, Malaysia
  • fYear
    2009
  • fDate
    18-19 Nov. 2009
  • Firstpage
    299
  • Lastpage
    304
  • Abstract
    This paper proposed an efficient omnidirectional thermal imaging system for machine condition monitoring. In this thermal imaging system, the omnidirectional scenes in a machine room, production plant, pump house, laboratory, etc within a factory site are first captured using a thermal camera attached to a custom made hyperbolic IR (infrared radiation) reflected mirror. The captured scenes with some machines to be monitored are then fed into a laptop computer for image processing and alarm purposes. Log-polar mapping is proposed to map the captured omnidirectional thermal image into panoramic image, hence providing the observer or image processing tools a complete wide angle of view. A simple and effective machine condition monitoring algorithm is also designed for monitored the normal/overheat condition for machines. The observed significances of this new proposed omnidirectional thermal imaging system include: it can cover a wide angle of view (360° omnidirectional), using minimum hardware, low cost and the output thermal images are with higher data compression. Experimental results show that the proposed thermal imaging system achieves high accuracy in monitoring machine condition.
  • Keywords
    condition monitoring; image processing; infrared imaging; machinery; mechanical engineering computing; alarm purposes; hyperbolic infrared radiation reflected mirror; image processing; laboratory; laptop computer; log-polar mapping; machine condition monitoring; machine room; omnidirectional thermal imaging system; overheat condition monitoring; panoramic image; production plant; pump house; thermal camera; Computerized monitoring; Condition monitoring; Image processing; Laboratories; Layout; Optical imaging; Production facilities; Production systems; Pumps; Thermal factors; Image Processing & Understanding; Machine condition monitoring; Omnidirectional System; Thermal imaging system;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal and Image Processing Applications (ICSIPA), 2009 IEEE International Conference on
  • Conference_Location
    Kuala Lumpur
  • Print_ISBN
    978-1-4244-5560-7
  • Type

    conf

  • DOI
    10.1109/ICSIPA.2009.5478665
  • Filename
    5478665