DocumentCode :
2564796
Title :
An 85 ns 16 Mb CMOS EPROM with alterable word organization
Author :
Higuchi, Masanori ; Koike, Masakazu ; Ninomiya, K. ; Watanabe, Toshio ; Koyama, Shinji ; Jinbo, T. ; Okazawa, T.
Author_Institution :
NEC Corp., Sagamihara, Japan
fYear :
1990
fDate :
14-16 Feb. 1990
Firstpage :
56
Lastpage :
57
Abstract :
An 85-ns, 16-Mb CMOS EPROM which features alterable word organization and can be configured as either 1 M*16 b or 2 M*8 b by controlling an input signal is described. The redundancy circuit consists of an erasable PROM cell and an unerasable PROM cell for the storage of a nonfunctional address. Divided bit lines and tungsten polycide word lines are the keys to 85-ns access time. This device meets the requirements for high-density EPROMs to be used with 16-b or 32-b microprocessors. The EPROM uses 0.6- mu m n-well CMOS technology. The 2.0*1.8- mu m core cell has been scaled using (1) self-aligned trench isolation refilled with BPSG, (2) oxide-nitride-oxide (ONO) interpoly dielectrics, and (3) a bit-line contact with a silicide pad and selective chemical-vapor-deposition (CVD) tungsten. The resulting 16-Mb EPROM has a die area of 7.1*17.1 mm. Trench isolation technology minimizes the spacing between memory cells and ensures durability against the high gate voltage used in programming. Two ONO structures with a thickness equivalent to 20 nm of oxide serve as the interpoly dielectrics. To reduce the parasitic resistance of the core cell transistor, a 200-nm-thick tungsten silicide layer and a selectively deposited tungsten plug are used for the bit-line contact.<>
Keywords :
CMOS integrated circuits; EPROM; VLSI; chemical vapour deposition; integrated circuit technology; 0.6 micron; 16 Mbit; 85 ns; CMOS EPROM; ONO structures; alterable word organization; bit-line contact; die area; divided bit lines; erasable PROM cell; gate voltage; n-well CMOS technology; nonfunctional address; oxide-nitride-oxide interpoly dielectrics; parasitic resistance; polycide word lines; redundancy circuit; selective chemical-vapor-deposition; self-aligned trench isolation; CMOS technology; Chemical technology; Circuits; Dielectrics; EPROM; Isolation technology; Microprocessors; PROM; Silicides; Tungsten;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference, 1990. Digest of Technical Papers. 37th ISSCC., 1990 IEEE International
Conference_Location :
San Francisco, CA, USA
Type :
conf
DOI :
10.1109/ISSCC.1990.110127
Filename :
110127
Link To Document :
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