• DocumentCode
    2565067
  • Title

    Extraction of aging markers for nanostructured epoxy resin aged under surface discharges

  • Author

    Fabiani, D. ; Cavallini, A. ; Montanari, G.C. ; Testa, L.

  • Author_Institution
    DIE-LIMAT, Univ. of Bologna, Bologna, Italy
  • fYear
    2009
  • fDate
    May 31 2009-June 3 2009
  • Firstpage
    387
  • Lastpage
    391
  • Abstract
    In this paper the effect of partial discharge induced degradation on epoxy-resin specimens filled by silica nanoparticles is discussed. In particular, the experimental results show that nanostructured materials exhibit longer failure times with respect to base epoxy resin and increasing nanofiller concentration the resistance to partial discharge activity improves significantly. Degradation evolution is investigated through continuous monitoring of partial discharges and periodic physical surface profile measurements. It is shown that the former provides useful quantities, e.g. inception phase, to be associated with the extent of specimen surface erosion. This allows PD endurance of nanostructured materials to be evaluated by means of on-line measurements which can provide further information also on PD erosion phenomenology (e.g., surface erosion or pit formation/growth).
  • Keywords
    ageing; epoxy insulation; nanoparticles; partial discharges; PD endurance; PD erosion phenomenology; aging marker extraction; degradation evolution; nanofiller concentration; nanostructured epoxy resin; online measurements; partial discharge induced degradation; partial discharge monitoring; periodic physical surface profile measurements; silica nanoparticles; surface discharges; Aging; Condition monitoring; Degradation; Epoxy resins; Nanoparticles; Nanostructured materials; Partial discharges; Silicon compounds; Surface discharges; Surface resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference, 2009. EIC 2009. IEEE
  • Conference_Location
    Montreal, QC
  • Print_ISBN
    978-1-4244-3915-7
  • Electronic_ISBN
    978-1-4244-3917-1
  • Type

    conf

  • DOI
    10.1109/EIC.2009.5166376
  • Filename
    5166376