DocumentCode :
2565154
Title :
Effects of permittivity of insulating materials on OFDM performance in power line communications
Author :
Alias, Mohamad Yusoff ; Kayani, Aminuddin Ahmad
Author_Institution :
Multimedia Univ., Cyberjaya, Malaysia
fYear :
2009
fDate :
18-19 Nov. 2009
Firstpage :
443
Lastpage :
448
Abstract :
Power line communication provides an attractive alternative to traditional networks both to the user and the public utilities companies as it offers broadband internet access, telephone service, cable television and home automation all of them collectively known as in-home services using the existing power delivery network. However, problems affecting power line communication transmission such as multipath noise, interference, frequency selective fading due to multipath, attenuation delays, and the presence of echoes, impulsive and coloured noise create the need to employ a suitable modulation scheme such as orthogonal frequency division multiplexing (OFDM) to counter its adverse effects on signal transmission. This paper analyzes the effects of permittivity of insulating materials on OFDM performance in terms of bit error rate (BER). From simulations, we can see that as the permittivity increases, the BER will become better.
Keywords :
Internet; OFDM modulation; broadband networks; cable television; carrier transmission on power lines; error statistics; home automation; insulating materials; OFDM performance; bit error rate; broadband internet access; cable television; coloured noise; frequency selective fading; home automation; impulsive noise; in-home services; insulating materials; multipath noise; orthogonal frequency division multiplexing; power delivery network; power line communication transmission; signal transmission; telephone service; Bit error rate; Cable TV; Colored noise; IP networks; Insulation; Internet telephony; OFDM; Permittivity; Power line communications; Web and internet services;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Signal and Image Processing Applications (ICSIPA), 2009 IEEE International Conference on
Conference_Location :
Kuala Lumpur
Print_ISBN :
978-1-4244-5560-7
Type :
conf
DOI :
10.1109/ICSIPA.2009.5478695
Filename :
5478695
Link To Document :
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