DocumentCode
2565636
Title
Breakdown and electrical aging tests on different nanocomposite materials
Author
Guastavino, F. ; Dardano, A. ; Squarcia, S. ; Tiemblo, P. ; Guzman, J. ; Benito, E. ; Garcia, N.
Author_Institution
Electr. Eng. Dept., Univ. of Genova, Genova, Italy
fYear
2009
fDate
May 31 2009-June 3 2009
Firstpage
529
Lastpage
533
Abstract
This work presents the output of a short and medium term electrical characterisation performed on different nanocomposite materials obtained by the dispersion of inorganic nanoparticles into a matrix of Low Density Polyethylene (LDPE). Two nanofillers were adopted: sepiolite and montmorillonite. Both nanofillers belong to the family of silicate clay minerals but have different aspect ratio. The nanocomposites have been prepared by melt dispersion of sepiolite, montmorillonite and a mixture (2.5/2.5 wt%) of both in LDPE. The outcome evidences that the dispersion of a mixture of nanoparticles having different geometry could be an interesting approach in order to enhance the electrical properties of polymeric insulation.
Keywords
ageing; aluminium compounds; calcium compounds; clay; conducting polymers; disperse systems; electric breakdown; filled polymers; magnesium compounds; materials preparation; mixtures; nanocomposites; nanoparticles; nanotechnology; polymer structure; sodium compounds; Mg4Si6O15(OH)2(H2O); Na0.2Ca0.1Al2Si4O10(OH)2(H2O)10; dispersions; electrical aging test; electrical breakdown; geometry; inorganic nanoparticle; low density polyethylene; mixture; montmorillonite; nanocomposite material; nanocomposite preparation; nanofiller; nanostructured material; polymeric insulation; sepiolite; silicate clay mineral; Aging; Electric breakdown; Geometry; Inorganic materials; Materials testing; Minerals; Nanoparticles; Nanostructured materials; Polyethylene; Polymers;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation Conference, 2009. EIC 2009. IEEE
Conference_Location
Montreal, QC
Print_ISBN
978-1-4244-3915-7
Electronic_ISBN
978-1-4244-3917-1
Type
conf
DOI
10.1109/EIC.2009.5166403
Filename
5166403
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