DocumentCode
2566040
Title
A 5 ns 369 kb port-configurable embedded SRAM with 0.5 mu m CMOS gate array
Author
Sawada, K. ; Takayanagi, T. ; Nogami, K. ; Takahashi, M. ; Uchida, M. ; Itoh, Y. ; Kobayashi, S. ; Noda, M. ; Matsuoka, F. ; Oyamatsu, H. ; Kakumu, M. ; Maeguchi, K. ; Iizuka, T.
Author_Institution
Toshiba Corp., Kawasaki, Japan
fYear
1990
fDate
14-16 Feb. 1990
Firstpage
226
Lastpage
227
Abstract
An SRAM that has column-sliceable peripheral circuitry embedded in a 235 K CMOS gate array and improved flexibility in configuration is described. The port-configurable (PC) SRAM cell achieves the minimum area overhead associated with the configurability by using four port-customization terminals at every memory-cell boundary. Prior to customization, first and second polysilicon are used to connect the internal memory-cell nodes to the port-customization terminals. Multiport SRAMs are configured by first Al so that corresponding internal nodes of adjacent memory cells are connected. At the same time, word lines are configured according to the port customization using second Al and the via hole. The use of second Al is a key to the density and speed. A high-resistance polysilicon load cell is used to provide good write operation and high density. The cell size is 9*13.6 mu m, one-tenth the area of an equivalent multiport cell based on gate-array basic cells. The worst-case access speed of multiport configuration based on this scheme has no dependence on the number of ports because the memory-cell current available to drive unit bit-line load capacitance remains constant. In the multiport configuration, the write operation from one port must flip all of the connecting cells through the NMOS transfer gate of the write port cell. Therefore, a six-transistor full CMOS SRAM cell is not suitable for PC SRAM.<>
Keywords
CMOS integrated circuits; SRAM chips; logic arrays; multiport networks; 0.5 micron; 369 kbit; 5 ns; Al; CMOS gate array; NMOS transfer gate; adjacent memory cells; column-sliceable peripheral circuitry; connecting cells; density; four port-customization terminals; high-resistance polysilicon load cell; internal memory-cell nodes; memory-cell boundary; memory-cell current; minimum area overhead; port-configurable embedded SRAM; word lines; worst-case access speed; write operation; Artificial intelligence; CMOS memory circuits; Capacitance; Decoding; Differential amplifiers; MOS devices; MOSFETs; Operational amplifiers; Random access memory; Semiconductor devices;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference, 1990. Digest of Technical Papers. 37th ISSCC., 1990 IEEE International
Conference_Location
San Francisco, CA, USA
Type
conf
DOI
10.1109/ISSCC.1990.110207
Filename
110207
Link To Document