DocumentCode :
2566325
Title :
ICs for mobile multimedia communications
Author :
Eul, Hermann
Author_Institution :
Infineon Technol., Munich
fYear :
2006
fDate :
6-9 Feb. 2006
Firstpage :
21
Lastpage :
39
Abstract :
The seemingly never-ending advancement of silicon technology has resulted in the emergence of mobile broadband communication systems for voice, data and video transmission with good connectivity and proper quality-of-service. Devices are being fabricated using processes managed at atomic levels, while IC design involves detailed systems engineering, including the incorporation of application content. Data-rate and mobility tradeoffs and different standards like 2G, 3G, Bluetooth, WLAN, GPS and digital-video broadcasting, are leading to multimode requirements and topics such as the coexistence of different technologies must be solved. Beyond all of that, secure data transfer using security checks like encryption is most important for the networked world. All of these various topics are, finally, the reason for the appearance of challenging architectural requirements, such as architectural re-configurability and programmability, motivated by the growing importance of multimode and multistandard solutions. While parameters such as data-rate and algorithmic- and circuit-complexity have changed approximately exponentially with time, there has not been much improvement in the battery capacity. For this reason key considerations for mobile products are energy management and power reduction. In this context, the introduction of platform concepts, including analog and RF at the most practical cost, power-levels and form-factors, are key requirements for system-on-chip and system-in-package solutions for current and future mobile multimedia terminals. This talk will explore current multi-million-transistor ICs with multi-billion operations per second of signal processing, along with analog and RF capabilities for mobile multimedia communications. It will also consider special requirements on wafer processes such as leakage and analog and RF capabilities, and will look at how R&D engineers bridge the world of system-level design, silicon and software. Of course, new chall- - enges going forward will be considered and explored
Keywords :
3G mobile communication; Bluetooth; digital video broadcasting; integrated circuit design; multimedia communication; quality of service; semiconductor technology; system-in-package; system-on-chip; wireless LAN; 2G communication; 3G communication; Bluetooth; GPS; WLAN; circuit-complexity; data transmission; digital-video broadcasting; encryption; integrated circuit design; mobile broadband communication; mobile multimedia communications; multimillion-transistor IC; quality-of-service; signal processing; silicon technology; system-in-package; system-on-chip; video transmission; voice transmission; Broadband communication; Content management; Design engineering; Disaster management; Engineering management; Mobile communication; Multimedia communication; Quality of service; Radio frequency; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference, 2006. ISSCC 2006. Digest of Technical Papers. IEEE International
Conference_Location :
San Francisco, CA
ISSN :
0193-6530
Print_ISBN :
1-4244-0079-1
Type :
conf
DOI :
10.1109/ISSCC.2006.1696031
Filename :
1696031
Link To Document :
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