Title :
Measurement of Young´s modulus on microfabricated structures using a surface profiler
Author :
Tai, Yu-Chong ; Mulle, Richard
Author_Institution :
California Univ., Berkeley, CA, USA
Abstract :
A point-force, load-deflection method using a stylus-type surface profiler to determine the Young´s moduli (EY) of thin-film microstructural materials is introduced. In this method both force and deflection in microstructures are measured simultaneously by the profiler to provide a convenient and accurate means to obtain Young´s modulus directly. Measurements on two types of micromechanical structures are described: a doubly supported bridge and a bridge-slider (a beam with one fixed end and one end that can slide in a flanged housing). The influence of residual stress in the doubly supported beam is described and accounted for theoretically to interpret measurements made on low-stress silicon-nitride films. For this material E Y is 373 GPa. In the bridge-slider structure, residual strain is relaxed to zero. Measurements on a polycrystalline-silicon bridge slider show a value for EY of 123 GPa in unannealed material that is doped heavily with phosphorous, and grown at 650°C
Keywords :
Young´s modulus; elastic moduli measurement; elemental semiconductors; insulating thin films; semiconductor thin films; silicon; silicon compounds; surface topography; 650 degC; Si:P; SiNx; Young´s modulus; bridge-slider; doubly supported bridge; load-deflection method; microfabricated structures; micromechanical structures; residual strain; surface profiler; unannealed material; Bridges; Capacitive sensors; Coatings; Force measurement; Laboratories; Microstructure; Residual stresses; Stress measurement; Testing; Transistors;
Conference_Titel :
Micro Electro Mechanical Systems, 1990. Proceedings, An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots. IEEE
Conference_Location :
Napa Valley, CA
DOI :
10.1109/MEMSYS.1990.110267