DocumentCode
2566986
Title
Ponderomotive Effects in Electromagnetic Accelerator
Author
Tolmachev, Yu.N. ; Wontaek Park ; Volynets, V.N. ; Pashkovsky, V.G. ; Jinwoo Yoo
Author_Institution
Nano Fabrication Center, Samsung Adv. Inst. of Technol., Yongin
fYear
2005
fDate
20-23 June 2005
Firstpage
125
Lastpage
125
Abstract
Summary form only given. ICP plasma source of new type for dry etching has been developed. It operates at frequency 2 MHz and is driven by planar inductive coil, which is placed at the top of the channel formed by two coaxial dielectric cylinders. This coil creates RF magnetic field having mainly radial component in the channel and induces azimuthal RF current in plasma. At sufficiently low pressure (about 1 mtorr) this causes substantial ponderomotive force acting on azimuthally moving electrons and directed toward the bottom of the channel. Due to charge separation, the ambipolar electric field is sustained, which retards electrons and accelerates ions. The source represents electrodeless electromagnetic accelerator (EMA) and can be used for creating axially directed fluxes of ions. EMA has been modeled as axisymmetric ICP discharge in Ar gas using finite element method (FEM) of solving Maxwell equations for first harmonic of magnetic field and basing on experimental data of plasma density and electron temperature profiles. Magnetic field and RF current densities obtained have been used for simulation of Lorentz force acting on electrons and calculation of resulting ambipolar plasma potential. Simulations of electron trajectories in this combined electric and magnetic field show that electrons are trapped in the EMA channel and make a number of oscillations before leaving the channel. Trapping of electrons in ICP plasma has been recently reported by other researchers for slab geometry. Thus formed ponderomotive potential produces acceleration of ions in the channel up to 10-20 eV depending on RF power deposited in the plasma
Keywords
Maxwell equations; argon; finite element analysis; high-frequency discharges; plasma density; plasma materials processing; plasma nonlinear processes; plasma oscillations; plasma simulation; plasma sources; plasma temperature; plasma transport processes; sputter etching; 10 to 20 eV; 2 MHz; Ar; Lorentz force simulation; Maxwell equations; RF current densities; RF magnetic field; ambipolar electric field; charge separation; coaxial dielectric cylinders; dry etching; electromagnetic accelerator; electron temperature; electron trajectories; electron trapping; finite element method; planar inductive coil; plasma density; plasma potential; plasma source; ponderomotive effects; Acceleration; Coils; Electrons; Magnetic fields; Plasma accelerators; Plasma applications; Plasma density; Plasma simulation; Plasma sources; Radio frequency;
fLanguage
English
Publisher
ieee
Conference_Titel
Plasma Science, 2005. ICOPS '05. IEEE Conference Record - Abstracts. IEEE International Conference on
Conference_Location
Monterey, CA
ISSN
0730-9244
Print_ISBN
0-7803-9300-7
Type
conf
DOI
10.1109/PLASMA.2005.359091
Filename
4198350
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