Title :
SMT single-versus dual-sided modules: a case study
Author_Institution :
Digital Equipment Corp., Colorado Springs, CO
Abstract :
The kind of thermal and reliability effect that can be expected when two single-sided surface mount technology (SMT) modules are combined into a single dual-sided SMT module is discussed. Temperature differences between like components mounted on a single-sided module and those mounted on a dual-sided module have been examined, and a mean time between failures (MTBF) difference is predicted for the case studied
Keywords :
modules; printed circuit design; printed circuit testing; reliability; surface mount technology; MTBF; SMT PCBs; case study; dual-sided SMT module; mean time between failures; reliability effect; single-sided SMT modules; thermal effect; Computer aided software engineering; Electronics cooling; Electronics industry; Electronics packaging; Heat transfer; Inductance; Printed circuits; Springs; Surface-mount technology; Temperature measurement;
Conference_Titel :
Semiconductor Thermal and Temperature Measurement Symposium, 1990. SEMI-THERM VI, Proceedings., Sixth Annual IEEE
Conference_Location :
Phoenix, AZ
DOI :
10.1109/STHERM.1990.68488
