DocumentCode
2569180
Title
Finite element modeling of the neuron-electrode interface: sealing resistance and stimulus transfer at transitions from complete to defect sealing
Author
Buitenwe, J.R. ; Rutten, W.L.C. ; Marani, E.
Author_Institution
Inst. for Biomed. Technol., Twente Univ., Enschede, Netherlands
Volume
6
fYear
1998
fDate
29 Oct-1 Nov 1998
Firstpage
2854
Abstract
The quality of the electrical contact between a cultured neuron and a substrate embedded microelectrode is of importance for effective transfer of an extracellular applied stimulus current to the intracellular potential. It is affected by the resistance of the seal, i.e. the gap between the cell membrane and the substrate, which restricts the leakage current, thereby favouring the efficiency of the stimulation current. The effects of variations in the geometry of the neuron-electrode interface on the sealing resistance and on the stimulus transfer are studied using a finite element model of this interface. Variations in the geometry of the neuron-electrode interface are represented by the eccentricity, xc, of a pillbox shaped neuron with radius rc, cultured on an electrode with radius r c. The results indicate a sharp decrease in both sealing resistance and stimulus transfer when a transition occurs from complete sealing to defect sealing. At that point the leakage current splits up into a current through the gap and a current through the sealing defect
Keywords
bioelectric phenomena; biomedical electrodes; cellular biophysics; finite element analysis; neurophysiology; physiological models; extracellular applied stimulus current; intracellular potential; leakage current; neuron-electrode interface; neuron-electrode interface geometry variations; pillbox shaped neuron; stimulation current efficiency; stimulus transfer; substrate embedded microelectrode; Cells (biology); Contacts; Electric resistance; Extracellular; Finite element methods; Geometry; Leakage current; Microelectrodes; Neurons; Seals;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 1998. Proceedings of the 20th Annual International Conference of the IEEE
Conference_Location
Hong Kong
ISSN
1094-687X
Print_ISBN
0-7803-5164-9
Type
conf
DOI
10.1109/IEMBS.1998.746079
Filename
746079
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