• DocumentCode
    2569257
  • Title

    An implantable glucose sensor for closed-loop artificial pancreas

  • Author

    Chung, T.D. ; Kim, H.C. ; Choi, S.B. ; Lee, H.K.

  • Author_Institution
    Inst. of Med. & Biol. Eng., Seoul Nat. Univ., South Korea
  • Volume
    6
  • fYear
    1998
  • fDate
    29 Oct-1 Nov 1998
  • Firstpage
    2868
  • Abstract
    A needle-type glucose sensor, which was based on teflon coated platinum-iridium (Pt-Ir) alloy wire of 0.2 mm diameter, 1.2 mm2 area of sensing part and 4 cm total length, was fabricated and its characteristics were examined. Carefully optimized inner, enzyme and outer layers were constructed on the Pt-Ir surface to enhance H2 O2 permeation and suppress interferences. An in vitro test of the resultant sensor in phosphate buffered saline (PBS) showed so high a selectivity that the electrochemical response to normal human glucose levels suffered only from limited drifts by physiological maximums of major interferents such as ascorbic acid, acetaminophenol, urea, and uric acid. In addition, good sensitivity and reproducibility over a month were observed. Continuous measurements in vivo with a surface modified sensor implanted in the subcutaneous layer were taken successfully
  • Keywords
    artificial organs; biosensors; organic compounds; 0.2 mm; 1 month; 4 cm; H2O2; H2O2 permeation enhancement; Pt-Ir; acetaminophenol; ascorbic acid; closed-loop artificial pancreas; electrochemical response; enzyme layer; implantable glucose sensor; major interferents; needle-type glucose sensor; phosphate buffered saline; physiological maximums; reproducibility; sensitivity; teflon coated platinum-iridium alloy wire; urea; uric acid; Biochemistry; Humans; In vitro; Interference suppression; Pancreas; Platinum alloys; Sensor phenomena and characterization; Sugar; Testing; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 1998. Proceedings of the 20th Annual International Conference of the IEEE
  • Conference_Location
    Hong Kong
  • ISSN
    1094-687X
  • Print_ISBN
    0-7803-5164-9
  • Type

    conf

  • DOI
    10.1109/IEMBS.1998.746083
  • Filename
    746083