DocumentCode :
2569728
Title :
Optical interconnect technologies for high-speed VLSI chips using silicon nano-photonics
Author :
Ohashi, Keishi ; Fujikata, Junichi ; Nakada, Masafumi ; Ishi, Tsutomu ; Nishi, Kenichi ; Yamada, Hirohito ; Fukaishi, Muneo ; Mizuno, Masayuki ; Nose, Koichi ; Ogura, Ichiro ; Urino, Yutaka ; Baba, Toshio
Author_Institution :
NEC, Tsukuba
fYear :
2006
fDate :
6-9 Feb. 2006
Firstpage :
1686
Lastpage :
1695
Abstract :
Optoelectronic and electrooptic elements are integrated on VLSI chips. The junction capacitance of a nano-photodiode is extremely low (<10aF), which permits a high load resistance to be used, resulting in higher output voltage at high frequencies. A ceramic Pb(,ZrTi)O3 film with average crystallite diameter below 20nm has a high electro-optical coefficient (>150pm/V) suitable for on-chip modulators. This paper introduces a new approach for realizing high-speed optical interconnects on silicon chips. This concept uses nano-photodiodes on silicon with extremely low parasitic capacitance (less than 10aF) enabling robust communication at very high frequencies. The results demonstrate 5GHz clocking with the promise of up to 20GHz. The authors will also discuss how the silicon nano-photodiode can be used for wavelength-division multiplexing and low-voltage electro-optic modulators for on-chip and off-chip optical communications
Keywords :
VLSI; electro-optical modulation; high-speed integrated circuits; integrated optoelectronics; optical interconnections; photodiodes; wavelength division multiplexing; 5 GHz; electrooptic modulators; high-speed VLSI chips; nanophotodiodes; on-chip modulators; optical interconnect; optoelectronic elements; silicon nano-photonics; wavelength-division multiplexing; Capacitance; Ceramics; Electrooptic modulators; Frequency; Optical films; Optical interconnections; Silicon; Ultraviolet sources; Very large scale integration; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference, 2006. ISSCC 2006. Digest of Technical Papers. IEEE International
Conference_Location :
San Francisco, CA
ISSN :
0193-6530
Print_ISBN :
1-4244-0079-1
Type :
conf
DOI :
10.1109/ISSCC.2006.1696224
Filename :
1696224
Link To Document :
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