Title :
Low-noise InGaAs HEMT using the new off-set recess gate process
Author :
Ishikawa, O. ; Nishii, K. ; Matsuno, T. ; Azuma, C. ; Ikeda, Y. ; Nanbu, S. ; Inoue, K.
Author_Institution :
Matsushita Electr. Ind. Co. Ltd., Osaka, Japan
Abstract :
A low-noise InGaAs HEMT (High electron mobility transistor) with a noise figure of 0.68 dB at 12 GHz has been developed using the offset recess gate process. The pseudomorphic n-AlGaAs/InGaAs HEMT structure was grown on a semi-insulating GaAs substrate by molecular-beam epitaxy. The offset recess gate process makes it possible to decrease the source and gate resistance. The breakdown voltage between gate and drain were above 6 V. A G/sub m/ of 510 mS/mm at minimum noise bias point was obtained in a 0.2- mu m-gate InGaAs HEMT. The minimum noise figure and associated gain of the device are 0.68 dB and 10.4 dB at V/sub ds/=2V, I/sub ds/=16 mA, and f=12 GHz, respectively. A three-stage amplifier using the new HEMT at the head has shown a minimum noise figure of 1.2 dB and a maximum gain of 31 dB.<>
Keywords :
III-V semiconductors; electron device noise; gallium arsenide; high electron mobility transistors; indium compounds; molecular beam epitaxial growth; solid-state microwave devices; 0.2 micron; 0.68 dB; 10.4 dB; 12 GHz; 6 V; AlGaAs-InGaAs-GaAs; GaAs substrate; HEMT; High electron mobility transistor; III-V semiconductors; MBE; SHF; breakdown voltage; low noise device; microwave device; molecular-beam epitaxy; off-set recess gate process; offset recess gate; pseudomorphic n-AlGaAs-InGaAs structure; three-stage amplifier; Dry etching; Electrodes; Electrons; Gallium arsenide; HEMTs; Indium gallium arsenide; Noise figure; Satellite communication; Semiconductor device noise; Silicon compounds;
Conference_Titel :
Microwave Symposium Digest, 1989., IEEE MTT-S International
Conference_Location :
Long Beach, CA, USA
DOI :
10.1109/MWSYM.1989.38886