Effect of Cross-Linking Density of Silicone Encapsulant on Sulfur Compound Gas Permeability of Light-Emitting Diode

Author

Yu Seong Lee ; Ki Hyun Kim ; Wan Ho Kim ; Min Ho Choi ; Chan-Hee Jung ; Jae-Hak Choi ; Jae-Pil Kim

Author_Institution

Lighting Sources & Mater. Res. Center, Korea Photonics Technol. Inst., Gwangju, South Korea

Volume

5

Issue

2

fYear

2015

fDate

Feb. 2015

Firstpage

163

Lastpage

167

Abstract

To study the effect of cross-linking density of silicone encapsulant on gas permeability, a light-emitting diode (LED) package was produced with two kinds of silicone, methyl-group (silicone A) and phenyl-group (silicone B), and a sulfur compound gas permeability test of the fabricated packages was performed. We found that the main penetration route of sulfur compound gas into the Ag-plated layer in an LED package could be directly observed by inserting Ag wire in an encapsulant. The persistency rate of radiant flux increased as the curing time of the silicone encapsulant became longer. When electron beam is irradiated on an LED package, the persistency of radiant flux is also increased.

Keywords

electron beams; electronics packaging; light emitting diodes; permeability; silicones; silver; sulphur; Ag; LED package; cross-linking density; curing time; electron beam; light-emitting diode package; methyl-group; persistency rate; phenyl-group; radiant flux; silicone encapsulant; sulfur compound gas permeability test; Compounds; Curing; Electron beams; Light emitting diodes; Polymers; Radiation effects; Cross-linking density; electron beam irradiation; gas permeability; light-emitting diodes (LEDs); silicone encapsulant; silicone encapsulant.;

fLanguage

English

Journal_Title

Components, Packaging and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

2156-3950

Type

jour

DOI

10.1109/TCPMT.2014.2387195

Filename

7014291