Title :
Precision passive alignment technologies for low cost array FTTH component
Author :
Ericson, Thomas ; Palmskog, Göran ; Eriksen, Paul ; Lundström, Pontus ; Granberg, Mats ; Bäcklin, Lennart ; Fröjd, Kister ; Vieider, Christian
Author_Institution :
ACREO AB, Kista, Sweden
Abstract :
A combination of microstructure technologies for silicon and polymers has been used to fabricate BCB waveguide FTTH array components with a MT interface. Passive alignment structures have been used for both the laser array and the optical interface
Keywords :
encapsulation; flip-chip devices; micro-optics; micromachining; optical communication equipment; optical couplers; optical fabrication; optical fibre subscriber loops; optical planar waveguides; plastic packaging; semiconductor laser arrays; BCB waveguide; LD arrays; MT interface; flip chip mounting; laser carrier; low cost array FTTH component; micromachining; microstructure technology; optical interface; planar waveguides; plastic encapsulation; polymer carrier; precision passive alignment technologies; Costs; Laser modes; Optical arrays; Optical fiber subscriber loops; Optical waveguides; Polymers; Semiconductor laser arrays; Silicon; Vertical cavity surface emitting lasers; Waveguide lasers;
Conference_Titel :
Optical MEMS, 2000 IEEE/LEOS International Conference on
Conference_Location :
Kauai, HI
Print_ISBN :
0-7803-6257-8
DOI :
10.1109/OMEMS.2000.879653
