Title :
Toward an interconnect programmable CMOS substrate for MCMS
Author :
Fraile, Marc ; Martínez, Ricardo ; Terés, Lluís
Author_Institution :
Departamento de Disefio de Circuitos y Sistemas Integrados, Univ. Autonoma de Barcelona, Spain
Abstract :
Multi-Chip Module (MCM) manufacturing technologies offers a new approach for reducing the size of electronics systems and improving its power consumption and speed. In order to take advantage of this and minimise cost, we should find ways of reusing a substrate in different applications. We have resumed the implementation of first test vehicle and it is presented the developed, characterisation and test of a second prototype (FPS-2M) and some other devices and the environment for test.
Keywords :
CMOS integrated circuits; integrated circuit interconnections; integrated circuit manufacture; multichip modules; MCMS; electronics systems size reduction; interconnect programmable CMOS substrate; multi-chip module manufacturing technologies; power consumption; CMOS technology; Ceramics; Circuit testing; Costs; Dielectric substrates; Integrated circuit interconnections; Integrated circuit packaging; Manufacturing; Prototypes; Vehicles;
Conference_Titel :
Semiconductor Conference, 2002. CAS 2002 Proceedings. International
Print_ISBN :
0-7803-7440-1
DOI :
10.1109/SMICND.2002.1105857
