DocumentCode
2572123
Title
Reversible wafer bonding for reliable compound semiconductor processing
Author
Dragoi, V. ; Glinsner, T. ; Mittendorfer, G. ; Wimplinger, M. ; Lindner, P.
Volume
2
fYear
2002
fDate
2002
Firstpage
331
Abstract
Reversible wafer bonding is a process enabling reliable compound semiconductor wafer handling for multi-step processes including photolithography, thinning, etching or coating. Two processes using wax and dry film adhesives are presented in this paper.
Keywords
adhesives; coating techniques; etching; materials handling; photolithography; reliability; wafer bonding; waxes; coating; compound semiconductor processing reliability; dry film adhesives; etching; multi-step processes; photolithography; reversible wafer bonding; thinning; wax bonding processes; Coatings; Etching; Gallium arsenide; Lithography; Optical films; Semiconductor device reliability; Semiconductor films; Semiconductor materials; Substrates; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Conference, 2002. CAS 2002 Proceedings. International
Print_ISBN
0-7803-7440-1
Type
conf
DOI
10.1109/SMICND.2002.1105861
Filename
1105861
Link To Document