Carrier impact on the thermal performance of tape-automated-bonding components

Author

Davis, Tracy L.

Author_Institution

IBM Corp., Austin, TX, USA

fYear

1990

fDate

6-8 Feb 1990

Firstpage

58

Lastpage

64

Abstract

The results of thermally characterizing a 160 I/O tape-automated-bonding (TAB) component are discussed. A finite-element technique was employed to understand and model the thermal processes of the TAB. A three-dimensional computer model is developed and validated against experimental data obtained for a 160 I/O TAB in a natural convection environment. The results of the model indicate that the thermal processes associated with the TAB are not two dimensional in nature. A substantial temperature variation is present across much of the device. Several carriers are modeled with the TAB to determine their thermal effect on the device´s thermal characteristics. Reducing the card´s cross-section from a 2S2P to a no-internal-plane (NIP) construction substantially affects the power dissipation capabilities of the component. However, the use of a molded rather than a FR4 material in the card has a negligible effect on the thermal characteristics of the attached device due to their similar thermal conductivity

Keywords

cooling; digital simulation; finite element analysis; lead bonding; packaging; 160 leaded component; 2S2P cards; 3D computer model; FR4 material; NIP cards; carrier impact; experimental data; finite-element technique; natural convection environment; power dissipation capabilities; tape-automated-bonding components; thermal performance; Bonding; Electronics packaging; Finite element methods; Heat transfer; Lead; Power dissipation; Silicon; Temperature; Thermal conductivity; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal and Temperature Measurement Symposium, 1990. SEMI-THERM VI, Proceedings., Sixth Annual IEEE

Conference_Location

Phoenix, AZ

Type

conf

DOI

10.1109/STHERM.1990.68491

Filename

68491