Carrier impact on the thermal performance of tape-automated-bonding components

The results of thermally characterizing a 160 I/O tape-automated-bonding (TAB) component are discussed. A finite-element technique was employed to understand and model the thermal processes of the TAB. A three-dimensional computer model is developed and validated against experimental data obtained for a 160 I/O TAB in a natural convection environment. The results of the model indicate that the thermal processes associated with the TAB are not two dimensional in nature. A substantial temperature variation is present across much of the device. Several carriers are modeled with the TAB to determine their thermal effect on the device´s thermal characteristics. Reducing the card´s cross-section from a 2S2P to a no-internal-plane (NIP) construction substantially affects the power dissipation capabilities of the component. However, the use of a molded rather than a FR4 material in the card has a negligible effect on the thermal characteristics of the attached device due to their similar thermal conductivity