Plasma Generation for Strip Applications: Micro-Wave vs RF Generation - Comparisons, Advantages and Trade-Offs

Summary form only given. A key etch processes for conductor etch is the post Al metal etch passivation and strip step. Typically this step is performed post Al etch to remove the remaining resist and to passivate the metal to prevent corrosion. An investigation was performed regarding the source for the chamber for passivation/strip (PS) with a comparison between different plasma sources: micro-wave vs RF. Common hardware and chamber configurations as well as process conditions were used as a baseline. The results show trade-off´s and benefits of the different approaches. In some cases, there is no significant difference between the sources. However, for other parameters the differences emerge. Data will be presented showing the comparison, benefits and limitations of the different plasma generation. The results will be discussed in the context of implications for SP optimization