DocumentCode
2572498
Title
Statistical worstcase interconnect modeling based on non-normal distributed process variations for nanometer era
Author
Jung, Won-Young ; Wee, Jae-Kyung
Author_Institution
Nanno Solutions, Inc., Sunnyvale
fYear
2007
fDate
22-25 Oct. 2007
Firstpage
1340
Lastpage
1345
Abstract
In this paper, we propose a new statistically-based approach for the characterization of the realistic worstcase interconnect models. In order to extract optimized parameters consistently in the worstcase simulation and to solve the non-normal distribution problems that were treated as normal distributions in the previous methods, the effective common geometry (ECG) and accumulated maximum probability (AMP) algorithms have been developed and implemented into the new statistical worstcase interconnect design environment. The delay time of the 31-stage ring oscillator that is manufactured in UMC 0.13 mum logic and 15-stage ring oscillator in 0.18 mum standard CMOS process was measured. When the algorithms were used to determine the worstcase, it was two times more accurate with the relative error less than 1.00% than that of the conventional Monte Carlo method (MCM). The new worstcase interconnect design environment improved the optimization speed by 32.01% compared to that of the conventional worstcase optimizer. The new worstcase interconnect design environment fast and accurately predicted the worstcase/bestcase of the non-normal distribution which conventional methods cannot do very well.
Keywords
CMOS logic circuits; integrated circuit interconnections; integrated circuit modelling; statistical analysis; CMOS process; UMC logic process; accumulated maximum probability; effective common geometry; nonnormal distributed process variations; ring oscillator; size 0.13 mum; size 0.18 mum; statistical worstcase interconnect modeling; worstcase simulation; Algorithm design and analysis; Delay effects; Design optimization; Electrocardiography; Gaussian distribution; Information geometry; Manufacturing processes; Probability; Ring oscillators; Solid modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
ASIC, 2007. ASICON '07. 7th International Conference on
Conference_Location
Guilin
Print_ISBN
978-1-4244-1132-0
Electronic_ISBN
978-1-4244-1132-0
Type
conf
DOI
10.1109/ICASIC.2007.4415886
Filename
4415886
Link To Document