DocumentCode
2572993
Title
Determination of the Sn/IMC ratio in solder joints combining electrochemistry and confocal microscopy
Author
Hurtony, Tamás ; Bonyár, Attila ; Luniak, Marco ; Müller, Maik
Author_Institution
Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Budapest, Hungary
fYear
2012
fDate
25-28 Oct. 2012
Firstpage
81
Lastpage
84
Abstract
In this work we present a novel method to determine the Sn/IMC (intermetallic compound) ratio in various SAC (Sn-Ag-Cu) alloy based solder joints utilizing selective electrochemical etching and confocal microscopy. We discuss the principles and possibilities of this combined method and present pilot measurement results regarding the determination of the Sn/IMC ratio for solder joints prepared with different soldering techniques.
Keywords
copper alloys; electrochemistry; silver alloys; soldering; solders; tin alloys; Sn-Ag-Cu; confocal microscopy; electrochemistry; intermetallic compound ratio; selective electrochemical etching; solder joints; soldering techniques; Etching; Intermetallic; Microstructure; Soldering; Tin; amperometry; confocal microscopy; intermetallic compound; solder joint;
fLanguage
English
Publisher
ieee
Conference_Titel
Design and Technology in Electronic Packaging (SIITME), 2012 IEEE 18th International Symposium for
Conference_Location
Alba Iulia
Print_ISBN
978-1-4673-4760-0
Electronic_ISBN
INAVLID ISBN
Type
conf
DOI
10.1109/SIITME.2012.6384351
Filename
6384351
Link To Document