Title :
Determination of the Sn/IMC ratio in solder joints combining electrochemistry and confocal microscopy
Author :
Hurtony, Tamás ; Bonyár, Attila ; Luniak, Marco ; Müller, Maik
Author_Institution :
Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Budapest, Hungary
Abstract :
In this work we present a novel method to determine the Sn/IMC (intermetallic compound) ratio in various SAC (Sn-Ag-Cu) alloy based solder joints utilizing selective electrochemical etching and confocal microscopy. We discuss the principles and possibilities of this combined method and present pilot measurement results regarding the determination of the Sn/IMC ratio for solder joints prepared with different soldering techniques.
Keywords :
copper alloys; electrochemistry; silver alloys; soldering; solders; tin alloys; Sn-Ag-Cu; confocal microscopy; electrochemistry; intermetallic compound ratio; selective electrochemical etching; solder joints; soldering techniques; Etching; Intermetallic; Microstructure; Soldering; Tin; amperometry; confocal microscopy; intermetallic compound; solder joint;
Conference_Titel :
Design and Technology in Electronic Packaging (SIITME), 2012 IEEE 18th International Symposium for
Conference_Location :
Alba Iulia
Print_ISBN :
978-1-4673-4760-0
Electronic_ISBN :
INAVLID ISBN
DOI :
10.1109/SIITME.2012.6384351
