Title :
Photo-Resist Ashing Byatmospheric Pressure Plasma
Author :
Han, K.H. ; Kang, J.G. ; Uhm, Han S. ; Kang, B.K.
Author_Institution :
Dept. of Molecular Sci. & Technol., Ajou Univ., Suwon
Abstract :
Summary form only given. Atmospheric plasma has an advantage not to use vacuum equipments. Thus, many researchers are beginning to develop methods of plasma generation at the atmospheric pressure and to find various industrial applications of the atmospheric plasmas, which may replace vacuum plasmas. Photo-resist (PR) ashing process has been conducted in vacuum plasma. PR ashing has been conventionally done in wet ashing and dry ashing. But the wet ashing have many problems including high-cost, environmental pollution and so on. Therefore, the dry ashing is more preferable process. Unfortunately, the present dry ashing requires the vacuum equipments at the moment. This paper presents experimental results of the PR ashing using glow plasma at the atmospheric pressure. The plasma generation is powered by a RF power source. The PR ashing by the atmospheric pressure plasma was investigated under various processing conditions. The ashing rate has been investigated in terms of processing temperature, gas composition, gas flow rate, RF power and exposure time. We measured PR thickness using micro-area gauge (NanoSpec/AFT). The results of this study will be useful for the optimization of ashing process conditions at the atmospheric pressure.
Keywords :
glow discharges; photoresists; plasma materials processing; plasma sources; surface treatment; RF power source; atmospheric pressure plasma; dry ashing; glow plasma; microarea gauge; photoresist ashing; plasma generation; vacuum plasmas; wet ashing; Atmospheric-pressure plasmas; Environmentally friendly manufacturing techniques; Industrial pollution; Plasma applications; Plasma materials processing; Plasma measurements; Plasma sources; Plasma temperature; Power generation; Radio frequency;
Conference_Titel :
Plasma Science, 2005. ICOPS '05. IEEE Conference Record - Abstracts. IEEE International Conference on
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-9300-7
DOI :
10.1109/PLASMA.2005.359440