Title :
Waffleline packaging techniques for millimeterwave integrated circuits
Author :
Rieder, G.C. ; Heckaman, D.E. ; Frisco, J.A. ; Vought, R.H. ; Higman, R.H. ; Perkins, G.R.
Author_Institution :
Harris Corp., Melbourne, FL, USA
Abstract :
A high-density packaging and interconnect technique called EHF Waffleline has been developed for millimeter-wave IC subsystems. This technology solves many of the size weight, and cost problems associated with present millimeter-wave packaging schemes. EHF Waffleline has been demonstrated and characterized up to 60 GHz, displaying excellent RF performance. In addition to the excellent electrical performance, EHF Waffleline offers very good mechanical and thermal characteristics, quick rework capability, and compatibility with automated assembly techniques. It is concluded that these characteristics make EHF Waffleline ideal for packaging and interconnecting GaAs monolithic ICs (integrated circuits) for miniature low-cost millimeter-wave systems.<>
Keywords :
MMIC; packaging; EHF Waffleline; GaAs; IC subsystems; RF performance; automated assembly; cost; high-density packaging; interconnect technique; millimeterwave integrated circuits; rework capability; size weight; thermal characteristics; Assembly; Costs; Gallium arsenide; Integrated circuit interconnections; Integrated circuit packaging; Millimeter wave integrated circuits; Millimeter wave technology; Monolithic integrated circuits; Radio frequency; Submillimeter wave integrated circuits;
Conference_Titel :
Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 1988. Technical Digest 1988., 10th Annual IEEE
Conference_Location :
Nashville, Tennessee, USA
DOI :
10.1109/GAAS.1988.11061
