• DocumentCode
    2573241
  • Title

    The Settlement Analysis of Soft Ground Improved by Vacuum-Surcharge Preloading Method

  • Author

    Yan-hui Ge ; Shu-cai Li ; Chuan-fu Li ; Guo-fu Sun ; Wang, Ming-Bin

  • Author_Institution
    Res. Centre of Geotechnical Eng., Shandong Univ., Jinan, China
  • fYear
    2009
  • fDate
    2-3 May 2009
  • Firstpage
    114
  • Lastpage
    117
  • Abstract
    The vacuum-surcharge preloading method is widely used in improving soft soil ground. Currently, many methods can be used to calculate the settlement of the ground; however, those analyses need too many parameters and are too complicated for the engineers to use. ANSYS program is a practical program to calculate the settlement of improved soft ground by vacuum-surcharge preloading method. Using the heat conduction instead of vacuum conduction, the vacuum load can be converted to nodal force which can be applied to the model. After inputting the nodal force and surcharge load into the model, the settlement can be calculated and is close to the monitoring results. Theniquestthe deformation and effects of vacuum and surcharge load are calculated and analyzed. The calculated results show that the stability of the subgrade tested is improved under the effect of vacuum load and the effect of vacuum is better than that of surcharge.
  • Keywords
    geotechnical engineering; mechanical engineering computing; soil; ANSYS program; heat conduction; nodal force; settlement analysis; soft ground improvement; soft soil ground; surcharge load; vacuum load; vacuum-surcharge preloading method; Civil engineering; Equations; Finance; Finite element methods; Moment methods; Plastics; Soil; Solid modeling; Sun; Testing; settlement analysis; soft ground improvement; style; surcharge preloading; vacuum preloading;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering Computation, 2009. ICEC '09. International Conference on
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-0-7695-3655-2
  • Type

    conf

  • DOI
    10.1109/ICEC.2009.67
  • Filename
    5167104