• DocumentCode
    2573259
  • Title

    Pressure measurements in a batch type Vapour Phase Soldering Station

  • Author

    Péter, Zsolt ; Géczy, Attila ; Illés, Balázs ; Illyefalvi-Vitéz, Zsolt

  • Author_Institution
    Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Budapest, Hungary
  • fYear
    2012
  • fDate
    25-28 Oct. 2012
  • Firstpage
    163
  • Lastpage
    166
  • Abstract
    As Vapour Phase Soldering (VPS) has again become a significant alternative method for reflow soldering [1], several investigations are in progress to determine the possibilities of the re-introduced technology. During Vapour Phase Soldering Galden fluid is heated, forming a layer of vapour inside the sealed processing zone of a VPS station. The controlling of transferred heat is done through condensation, and the amount of condensation depends on the temperature of the board and the amount of available vapour. The basic method of VPS implies soldering should be carried out under steady state conditions with saturated vapour. Therefore, identification of the level of the saturated vapour layer is essential. Yet, this is commonly accomplished only by temperature measurements inside the processing zone [2]. This paper presents how pressure parameters of the processing zone of an experimental VPS system were measured with novel methods. The results indicate that from the aspect of soldering, the saturated vapour indication is more precise and immediate than temperature measurements with thermocouples.
  • Keywords
    condensation; pressure measurement; seals (stoppers); soldering; batch type vapour phase soldering station; board temperature; condensation; pressure measurements; saturated vapour indication; sealed processing zone; transferred heat; vapour layer; vapour phase soldering Galden fluid; Cooling; Heating; Pressure measurement; Soldering; Temperature measurement; Temperature sensors; Vapour phase soldering; pressure profiling; reflow soldering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design and Technology in Electronic Packaging (SIITME), 2012 IEEE 18th International Symposium for
  • Conference_Location
    Alba Iulia
  • Print_ISBN
    978-1-4673-4760-0
  • Electronic_ISBN
    INAVLID ISBN
  • Type

    conf

  • DOI
    10.1109/SIITME.2012.6384368
  • Filename
    6384368