DocumentCode :
257330
Title :
Analysis of Electrical Responses of MEMS Piezoresistive Microcantilever
Author :
Ab Rahim, Rosminazuin ; Abubakkar, Sheik Fareed Ookar ; Bais, Badariah ; Majlis, Burhanuddin Yeop
Author_Institution :
Fac. of Eng., Int. Islamic Univ. Malaysia, Kuala Lumpur, Malaysia
fYear :
2014
fDate :
23-25 Sept. 2014
Firstpage :
123
Lastpage :
126
Abstract :
In this paper, an optimization of mechanical and electrical performance of single-layer silicon piezoresistive microcantilever (PRM) sensor in which both piezoresistor and microcantilever structures are made of the same material of single-crystalline silicon was discussed. Using CoventorWare 2008, the mechanical and electrical behaviors of the PRM structure was investigated by studying few contributing factors that affect the performance of the device. The performance of PRM sensor was investigated by observing the effects of applied loads to the current change and sensitivity of the device. Apart from that, the effects of thermal noise to the device´s performance were also investigated. From the simulation results, at applied loads between 1 to 10 μN, significant current increase of about 0.094% was observed. This current increase can be translated into an increase of sensitivity in the device. Simulation results also revealed that at temperature change between 290 K to 300 K, the PRM sensor shows insignificant change to sensitivity.
Keywords :
cantilevers; elemental semiconductors; microsensors; piezoresistive devices; resistors; silicon; thermal noise; CoventorWare 2008; MEMS piezoresistive microcantilever; Si; electrical responses; microcantilever structures; optimization; piezoresistor structure; single-crystalline silicon; single-layer silicon PRM sensor; temperature 290 K to 300 K; thermal noise; Abstracts; Computational modeling; Computers; Load modeling; Micromechanical devices; Sensitivity; Thermal loading; Coventor Ware 2008; MEMS; microcantilever; piezoresistor;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer and Communication Engineering (ICCCE), 2014 International Conference on
Conference_Location :
Kuala Lumpur
Type :
conf
DOI :
10.1109/ICCCE.2014.45
Filename :
7031616
Link To Document :
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