• DocumentCode
    2573593
  • Title

    Tetrahedral shaped recess channel HEMT with a floating quantum dot gate

  • Author

    Shima, M. ; Sakuma, Y. ; Futatsugi, T. ; Awano, Y. ; Yokoyama, N.

  • Author_Institution
    Fujitsu Ltd., Atsugi, Japan
  • fYear
    1998
  • fDate
    6-9 Dec. 1998
  • Firstpage
    437
  • Lastpage
    440
  • Abstract
    For the first time in the world, we achieved, at 77 K, a transistor and memory operation of an FET structure which was grown in a tetrahedral-shaped recess (TSR-HEMT). This TSR-HEMT memory has a floating quantum dot (QD) gate at the bottom of the recess. Owing to the particular shape of the tetrahedral-shaped recess (TSR) structure, we were able to demonstrate that the charging of the floating QD gate can modulate the potential energy near the bottom by an amount of 9 meV and thus effectively modify the current. The measured I-V characteristics of the memory device clearly indicated a hysteresis at the sub-threshold gate bias region and a low power operation requiring write/erase voltages around only 1 V. The measured retention characteristics also showed that the device had a retention time of several minutes even at 100 K. We think that the TSR-HEMT is a promising structure for the use in future nanometer-scale microelectronics.
  • Keywords
    high electron mobility transistors; low-power electronics; semiconductor quantum dots; 1 V; 77 K; I-V characteristics; floating quantum dot gate; low power operation; memory operation; nanometer-scale microelectronics; potential energy; retention time; sub-threshold gate bias region; tetrahedral shaped recess channel HEMT; write/erase voltages; FETs; HEMTs; Hysteresis; Nanoscale devices; Potential energy; Power measurement; Quantum dots; Shape; Time measurement; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1998. IEDM '98. Technical Digest., International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0163-1918
  • Print_ISBN
    0-7803-4774-9
  • Type

    conf

  • DOI
    10.1109/IEDM.1998.746392
  • Filename
    746392