Investigation of the oxidation process at the copper-solder interface with atomic force microscopy

Author

Bonyár, Attila ; Hurtony, Tamás ; Dávid, Szabolcs

Author_Institution

Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Budapest, Hungary

fYear

2012

fDate

25-28 Oct. 2012

Firstpage

317

Lastpage

320

Abstract

In this work the investigation of copper-solder interface with Atomic Force Microscope (AFM) is presented. Multiple contact and tapping-mode AFM images were made on presoldered cross-sectional SAC (Sn-Ag-Cu) solder joint samples. The formation of oxide layer was observed and the structural properties of oxide were monitored in time. Our aim was to determine the maximum idle time between the sample preparation and the further analysis, based on only the monitored corrosion profile of the copper-solder interface.

Keywords

atomic force microscopy; copper; corrosion; gold alloys; oxidation; silver alloys; solders; tin alloys; Sn-Ag-Cu; atomic force microscopy; copper-solder interface; corrosion profile; multiple contact; oxidation process; structural properties; tapping-mode AFM image; Atomic force microscopy; Copper; Corrosion; Oxidation; Surface treatment; Tin; Atomic Force Microscope (AFM); corrosion; intermetallic compounds;

fLanguage

English

Publisher

ieee

Conference_Titel

Design and Technology in Electronic Packaging (SIITME), 2012 IEEE 18th International Symposium for

Conference_Location

Alba Iulia

Print_ISBN

978-1-4673-4760-0

Electronic_ISBN

INAVLID ISBN

Type

conf

DOI

10.1109/SIITME.2012.6384400

Filename

6384400